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Software/Firmware Engineers | [²é¿´¸ü¶àÀàËÆÖ°Î»] |
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ְλÀà±ð£º ¼ÆËã»úÈí¡¢Ó²¼þ/»¥ÁªÍø/IT ¹¤×÷µØµã£º ÉîÛÚ ·¢²¼ÈÕÆÚ£º 2008-04-30 ¹¤×÷¾Ñ飺 1-3Äê ×îµÍѧÀú£º ±¾¿Æ ¹ÜÀí¾Ñ飺 ·ñ ¹¤×÷ÐÔÖÊ£º ȫְ ÕÐÆ¸ÈËÊý£º Èô¸É ְλÃèÊö/ÒªÇó£º Job Responsibilities: Software development for semiconductor packaging equipment . Job Requirements: 1. Master /Bachelor Degree in Electronic/Electrical/Computer Science/Physic . 2. 2 years or more of working experience in Software Development. 3. Good knowledge of C, C++ and OOP programming 4. Strong working knowledge of ONE or more of the following areas is essential . 5. Programming on Microsoft Windows OS or Linux OS . 6. Object Oriented Design and programming . 7. System programming for Windows or Linux . 8. Software Testing and Life Cycle Development . 9. Software development on MS .Net or Web Applications . 10. Real time programming for servo/motion control . 11. Software/firmware development with PC, DSP and microcontroller . 12. Software development for electromechanical system testing . ÁªÏµ·½Ê½£º Interested applicants should send their CV both in English and Chinese to Mr. He Sheng at she@asmpt.com , with indication to which position interested . .
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