职位类别： 电子/半导体/仪表仪器 工作地点： 上海 发布日期： 2008-04-30 工作经验： 1-3年 最低学历： 本科 管理经验： 否 工作性质： 全职 招聘人数： 若干 职位描述/要求： 受新加坡某半导体公司委托，招聘Tapeout Engineer / Senior Engineer (Multi Project Wafers) 工作地点：新加坡 Responsibilities: Drive and manage the MPW schedules at every stage (Requirements review, Design Rule Checks review, Tapeout process, Wafer starts, Dies shipments). Consolidate and confirm tapeout&process requirements with Engineering Account Managers and Foundry Process Owners. Planning of devices layout on the reticle floorplan to achieve optimum die saw conditions. Planning of tapeout modifications required to meet the process mix. Communicate with Process Owner on lot split matrix. Issue instructions to die saw vendors on die saw and shipping arrangements. Consolidate PTRFs and FGRF for submission to Tapeout Centre. Liase with Tapeout Applications on DRC results. Perform mebes jobview and coordinate mask write release with customers and device owners. Communicate with regions on lots movement issues if any. Drive / participate in departmental continuous improvement projects. Document operating procedures and training materials. Continuously improve tapeout prototype cycle time&quality. Requirements: At least 1 year"s experience in wafer fab. Problem solving skill, strong interpersonal skill&independence to drive continuous improvements. 联系方式： .
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