职位类别： 电子/半导体/仪表仪器 工作地点： 上海 发布日期： 2008-03-13 工作经验： 5-10年 最低学历： 大专 管理经验： 否 工作性质： 全职 招聘人数： 若干 职位描述/要求： Job Descrption: 1) Support SIP memory Cards and BGA/LGA SMT based component sample build on Lasr marking, SSG, Laser Cutting during product/Process Development stage. 2) Dimension measurement by using ICOS/STI/OGP/X-section etc to buy off backend porcess. 3) New Process/Tool/Equipment Development on Lasr marking, SSG, Laser Cutting. 4) Design review for new product on Lasr marking, SSG, Laser Cutting.(DFM) 5) Coach new hire RnD engr in English. Job Requirement: 1) Academic qualification: College, Bachelor or above. 2) Language ability: CET4, and is GOOD on English conversation. 3) Computer skill: Good at MS office and Email. 4) At least 4 years of experience on engineering for equipments and process in Semiconductor Assembly Industry. 5) 1 year or above Experience on RnD in Semiconductor is preferred. 联系方式： .
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