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Cisco-Senior Hardware Signal Integrity Engineer | [查看更多类似职位] |
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工作地点 |
上海 |
发布日期 |
2008-03-23 |
工作年限 |
不限 |
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薪水范围 |
面议 | 学历要求 | 本科 |
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| 职位描述 |
职位类别： 计算机软、硬件/互联网/IT 工作地点： 上海 发布日期： 2007-12-24 工作经验： 不限 最低学历： 本科 职位月薪： 面议 工作性质： 全职 招聘人数： 若干 管理经验： 否 职位描述/要求： Cisco ISBU Introduction Cisco Internet Systems Business Unit (ISBU) develops industry leading Catalyst 6500 data center switches. ISBU team at CRDC concentrates on next-generation System Engineering developments for Cat6K. Position : Senior Hardware Signal Integrity Engineer (1 openings) Job Description: Cisco’s ISBU System Packaging Group is seeking self-motivated individuals responsible for the design and analysis of very high speed digital interfaces and power distribution networks. In this Sr. Signal&Power Integrity Engineering position you will be pushing technology to the limits while designing 6Gbs and beyond for current and next generation state of the art network switching products. Responsibilities: Using analytical and simulation tools to define design requirements at system level. Making use of both time and frequency domain tools for simulation of high speed serial links (chip to chip and across backplanes). Using 2D and 3D modeling tools you will play a key role to generate library of frequency dependent models for physical structures such as transmission lines, vias, and connectors. Performing Power Integrity analysis and generating power delivery network requirements Performing timing, clock distribution and voltage margin analysis and generate requirements for placement and routing based on simulations. Correlate simulation results with laboratory measurements using high speed Oscilloscopes, VNA, PNA, TDR, Bit Error rate testers, and Spectrum analyzer. Skills required: You should have solid understanding of SerDes design, PLL design, LVDS, SSTL, HSTL, CML, and other high performance I/O technologies. Proficiency in HSPICE, Matlab, 3d modeling tools such as Ansoft HFSS and / or CST Microwave studio is required. Familiarity with Sigrity or Optimal tools for power integrity analysis is highly desirable. Familiarity with board level simulation tools such as SiSoft, ICX, Specctraquest, or XTK is a plus. You should have excellent analytical, communication and documentation skills. Education Background: Typically requires MSEE or PhD with 5 to 7 years of related experience or BSEE with 10+ years of related experience. Position 3: Senior Mechanical Engineer (3 openings) Job Description: Perform complex role on project team involving the entire product packaging design process. Candidate is responsible for the design and the documentation of computer enclosures and related electro-mechanical assemblies. Conceptualize, plan and execute the design and development of switch products. Conducts design verification tests and develop and conduct specialized tests. Create schedules for medium to large tasks and may be required to manage remote development activities. Resolve field and production problems. Participate in cross-functional consultation with Customer Advocacy, Manufacturing, Marketing and Hardware Engineering groups. Conduct internal and external design reviews with design team and vendors. Skills Required: Proficient in designing high volume, cost effective products that meet worldwide environmental compliance requirements. (RoHS, etc) Experience in designing parts for volume processes, injection molding, die casting, sheetmetal punch and form. And working closely with vendor to during tooling development. Technical expertise in 3D solids based MCAD systems, Unigraphics NX, ProE, or Ideas SDRC 3-D 4000hr of recent experience preferred for maximum productivity. Working knowledge in structural analysis SW tools. (Ansys) Ability to read and interpret mechanical drawings. Proficient in geometric dimensioning&tolerance and perform complex tolerance analysis. Able to generate test plans, conduct tests and generate test reports for MDVT effort. Understanding of Safety Agency design criteria and EMC design techniques for modules and enclosures. Experience designing, testing and project managing the development of computer products for worldwide commercial use. Understand process tolerances for sheet metal fabricated and injection molded parts. Working knowledge of Project Management process and schedule tools. Fluent communication skills in English, both written and verbal .Ability to select electro-mechanical components such as air move rs, heatsinks and connectors. Identify components needed for complex interconnection systems. Grace under pressure and positive attitude are mandatory Enjoys working in fast paced and often multi-project environment. Skilled with Microsoft Word, Excel, Power Point, etc Thermal management and structural design experience. Education Background: BSME with 7-10 years, or MSME with 7+ years, of related experience 联系方式： alice.wu@zhaopin.com.cn vivian.xia@zhaopin.com.cn .
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