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Principal Board Level Engineer


Electric Engineer


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LTE System Engineer


LTE HW Senior Engineer


NEW PRODUCT INTRODUCTION ENGINEER


58174-System&Applications engineer


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Hardware Engineer


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ְλÀà±ð£º µç×Ó/°ëµ¼Ìå/ÒDZíÒÇÆ÷ ¹¤×÷µØµã£º ÉϺ£ ·¢²¼ÈÕÆÚ£º 2007-10-22 ¹¤×÷¾­Ñ飺 1-3Äê ×îµÍѧÀú£º ²»ÏÞ Ö°Î»ÔÂн£º ÃæÒé ¹¤×÷ÐÔÖÊ£º ȫְ ÕÐÆ¸ÈËÊý£º 1ÈË ¹ÜÀí¾­Ñ飺 ·ñ ְλÃèÊö/ÒªÇó£º GENERAL FUNCTION: Reporting to the Engineering Manager, responsible for multiple functions in the area design of new products and PCB (printed Circuit Board) layout for the R team, making on-going Schematic/PCB chances for high performance Voltage Controlled Oscillators (VCO"s), Phase Locked Loop"s (Pll"s), IC Reference boards, and Application boards. DUTIES: 1. Perform high level of layout and drafting of engineering designs and sketches. Put together a final product of designing for presentation. 2. Calculate and interpret engineering design to make sure that designed product specifications are within industrial standard. 3. Design, and make Shcematic/PCB changes for high performance VCO, PLL modules, IC reference boards, and application boards for various wireless applications, including GSM, CDMA, UWB, WiFi and Wimax protocols. 4.Validate changes on lab documenting BOM changes. 5. Perform Design Rule Check (DRC) setup on the layout design, and follow Design for Manufacturability (DFM) and Design for Test(DFT) concept. 6. Develop symbols and CAD library database using PADS, AUTOCAD, and Powerlogic. 7. Generate Gerber files, reports, and electronic PCB documentation. 8. Develop methodologies to enhance layout productivity. 9. Interface external PCB Vendor. 10. Ability to manage multiple projects and meet deadlines. REQUIREMENTS: 1. BSEE with minimum 2 years experience in PCB layout of RF circuit and system. 2. Candidate must have experience in high-density circuit-board design, layout and fabrication using state of the art surface mount components and techniquess. 3. Understanding of RF design techniques is perferred. 4. Substrate layout of wirebond and flip chip packages is preferred. 5. Experience with PADS, Protel, AUTOCAD, Powerlogic, Agile PLM, and Basic ERP/MRP systems. ÁªÏµ·½Ê½£º .
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